Huawei proposes new path for chip development amid US sanctions

Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting access to cutting-edge semiconductor technology. Huawei's upcoming Kirin chips will feature a related 'LogicFolding' architecture. The company has already produced hundreds of chips based on this new principle.