While Intel has been busy making bets on its 18A node as part of its accelerated roadmap towards chip making dominance, TSMC appears to have been beavering away in the background to undercut it.
It's just announced its own "angstrom-class" process, A16, which thanks to its backside power delivery implementation looks set to not only offer significantly improved performance compared to its upcoming NP2 process, but also improve energy efficiency, too. Intel has its own competing backside power delivery tech, PowerVia.